T. Zheng

Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling

W. Li, A. Vandooren, Liesbeth Witters, 2018, 2018 International Conference on IC Design & Technology (ICICDT).

3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability

F. M. Bufler, F. Inoue, R. Ritzenthaler, 2018, IEEE Transactions on Electron Devices.

3D sequential stacked planar devices on 300 mm wafers featuring replacement metal gate junction-less top devices processed at 525°C with improved reliability

B. Parvais, A. Vandooren, G. Hellings, 2018, 2018 IEEE Symposium on VLSI Technology.

First Demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers

B. Parvais, A. Vandooren, J. Ryckaert, 2018, 2018 IEEE International Electron Devices Meeting (IEDM).