G. Gaudin
发表
F. M. Bufler,
F. Inoue,
R. Ritzenthaler,
2018,
IEEE Transactions on Electron Devices.
Robert Langer,
Matty Caymax,
Bernardette Kunert,
2016
.
B. Parvais,
A. Vandooren,
G. Hellings,
2018,
2018 IEEE Symposium on VLSI Technology.
N. Collaert,
W. Schwarzenbach,
B. Nguyen,
2019,
2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).
S. Sollier,
J. Widiez,
B. Colombeau,
2016,
2016 21st International Conference on Ion Implantation Technology (IIT).
F. Fournel,
C. Morales,
J. Widiez,
2015,
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
S. Sollier,
J. Widiez,
F. Fournel,
2016
.
Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration
T. Signamarcheix,
I. Radu,
T. Lacave,
2013
.
H. Grampeix,
S. Sollier,
J. Widiez,
2016
.
An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization
Pierric Gueguen,
Rachid Taibi,
Laurent Clavelier,
2011
.
Shawn G. Thomas,
W. Schwarzenbach,
J. Widiez,
2022,
Materials Science Forum.
A. Jourdain,
A. Hikavyy,
G. Mannaert,
2022,
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
A. Hikavyy,
G. Mannaert,
E. Rosseel,
2020,
2020 IEEE Symposium on VLSI Technology.
Laurent Clavelier,
Didier Landru,
Ionut Radu,
2010
.
Didier Landru,
Mariam Sadaka,
Ionut Radu,
2010,
2010 IEEE International 3D Systems Integration Conference (3DIC).
J. Dechamp,
L. Clavelier,
F. Letertre,
2010,
2010 IEEE International 3D Systems Integration Conference (3DIC).