D. Price

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

D. Flynn, C. Bailey, M. Desmulliez, 2016 .

Copper electroplating of PCB interconnects using megasonic acoustic streaming.

D. Flynn, M. Desmulliez, T. Jones, 2018, Ultrasonics sonochemistry.

Megasonic agitation for enhanced electrodeposition of copper

C. Bailey, M. Desmulliez, D. Hutt, 2009 .

Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

C. Bailey, M. Desmulliez, D. Price, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs.

D. Flynn, M. Desmulliez, T. Jones, 2020, Ultrasonics.

Implementing new surface pre-treatment processes in the PCB industry through the application of acoustic agitation

David Flynn, Thomas D. A. Jones, Marc P.Y. Desmulliez, 2015 .

A highly compact packaging concept for ultrasound transducer arrays embedded in neurosurgical needles

Marc P.Y. Desmulliez, Christine E. M. Demore, Sandy Cochran, 2017 .

Copper electroplating of PCB interconnects using megasonic acoustic streaming.

D. Flynn, M. Desmulliez, T. Jones, 2018, Ultrasonics sonochemistry.

Low temperature flip-chip packaging based on screen printing technology

C. Bailey, M. Desmulliez, J. Gourlay, 2003 .