Robert Derix

Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2013 .

New Method to Separate Failure Modes by Transient Thermal Analysis of High Power LEDs

G. Elger, A. Hanss, Robert Derix, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis

Gordon Elger, Robert Derix, Shri Vishnu Kandaswamy, 2014, 20th International Workshop on Thermal Investigations of ICs and Systems.

Analysis of crack length and crack position in the Solder Joints of High Power LEDs by Transient Thermal Measurements and Finite Element Simulations

G. Elger, U. Tetzlaff, S. V. Kandaswamy, 2014 .

Analysis of new direct on PCB board attached high power flip-chip LEDs

Gordon Elger, Maximilian Schmid, Robert Derix, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

SiliconPV 2012 generation of defect-related acceptor states by laser doping

H. Kurz, S. Suckow, T. Pletzer, 2012 .