H. Hokazono
发表
S. Koyama,
Yu Tonozuka,
I. Shohji,
2017,
2017 International Conference on Electronics Packaging (ICEP).
A. Morozumi,
Y. Nishimura,
E. Mochizuki,
2015
.
M. Sakane,
Takamoto Itoh,
H. Hokazono,
2018,
International Journal of Fatigue.
M. Sakane,
Takamoto Itoh,
H. Hokazono,
2016
.
Y. Kariya,
H. Hokazono,
Hirohiko Watanabe,
2016
.
Y. Kariya,
H. Hokazono,
Hirohiko Watanabe,
2017,
Journal of Electronic Materials.
T. Sakai,
Y. Kariya,
H. Hokazono,
2019,
Journal of Smart Processing.
I. Shohji,
H. Hokazono,
Kyosuke Kobayashi,
2016
.
S. Koyama,
I. Shohji,
H. Hokazono,
2017
.
M. Sakane,
H. Hokazono,
M. Yamashita,
2012,
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
M. Saka,
H. Hokazono,
Xu Zhao,
2013
.
H. Hokazono,
X. Zhao,
M. Saka,
2012,
Microsystem Technologies.
M. Saka,
H. Hokazono,
Xu Zhao,
2012
.
M. Saka,
M. Muraoka,
H. Hokazono,
2014,
Journal of Electronic Materials.
H. Hokazono,
N. Hiyoshi,
M. Yamashita,
2017
.
Yoshitaka Nishimura,
Akira Morozumi,
Yoshinari Ikeda,
2013,
2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD).