B. Platek

发表

P. Matkowski, J. Felba, A. Moscicki, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

P. Matkowski, J. Felba, P. Demont, 2011, 2011 11th IEEE International Conference on Nanotechnology.

J. Felba, T. Falat, B. Platek, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Johan Liu, P. Matkowski, J. Felba, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Johan Liu, P. Matkowski, J. Felba, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

J. Felba, T. Falat, B. Platek, 2014, Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.

J. Felba, J. Felba, M. Zawierta, 2013, 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).

J. Felba, T. Falat, B. Platek, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

J. Felba, T. Falat, B. Platek, 2010, 3rd Electronics System Integration Technology Conference ESTC.

J. Felba, T. Falat, B. Platek, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.