D. Wakuda

Room temperature sintering mechanism of Ag nanoparticle paste

D. Wakuda, Keun-Soo Kim, K. Suganuma, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Room-Temperature Sintering Process of Ag Nanoparticle Paste

K. Suganuma, Keun-Soo Kim, D. Wakuda, 2009, IEEE Transactions on Components and Packaging Technologies.

Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding

K. Suganuma, Keun-Soo Kim, D. Wakuda, 2009, International Conference on Nanotechnology.

Room temperature sintering of Ag nanoparticles by drying solvent

K. Suganuma, Keun-Soo Kim, D. Wakuda, 2008 .

Novel method for room temperature sintering of Ag nanoparticle paste in air

K. Suganuma, D. Wakuda, M. Hatamura, 2007 .

Low-Temperature Wiring with Ag Nanoinks [Nanopackaging]

K. Suganuma, M. Nogi, D. Wakuda, 2010, IEEE Nanotechnology Magazine.

Properties of Ag nanoparticle paste for room temperature bonding

Katsuaki Suganuma, Keun-Soo Kim, K. Suganuma, 2009, Electronic Components and Technology Conference.

Room temperature sintering of ag nano-scale particles with drying of the solvent

K. Suganuma, Keun-Soo Kim, D. Wakuda, 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.

Low-temperature low-pressure die attach with hybrid silver particle paste

K. S. Kim, S. Sakamoto, K. Suganuma, 2012, Microelectron. Reliab..

Stretchable fine fiber with high conductivity fabricated by injection forming

Katsuaki Suganuma, K. Suganuma, D. Wakuda, 2011 .

Ag Nanoparticle Paste Synthesis for Room Temperature Bonding

K. Suganuma, Keun-Soo Kim, D. Wakuda, 2010, IEEE Transactions on Components and Packaging Technologies.

Low-Temperature Wiring with Ag Nanoinks

K. Suganuma, M. Nogi, D. Wakuda, 2010 .