E. Egan

Ultrawide AWG with hyper-Gaussian profile

H. Yamada, B. Fondeur, A. Sala, 2004, IEEE Photonics Technology Letters.

A thermomechanical model for warpage prediction of microelectronic packages

Michael Peter Kennedy, Gerard Kelly, Eric Egan, 2002 .

Response surface methodology for matrix PBGA warpage prediction

E. Egan, L. Herard, G. Kelly, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability

E. Egan, L. Herard, E. Egan, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).