Walter Schwarzenbach

How FD-SOI is revolutionizing next-gen microelectronics: IoT, automotive and mobile connectivity applications : (Invited Paper)

Bich-Yen Nguyen, Christophe Maleville, Walter Schwarzenbach, 2018, 2018 International Conference on Advanced Technologies for Communications (ATC).

Reliability of ultra-thin buried oxides for multi-VT FDSOI technology

X. Garros, A. Toffoli, G. Reimbold, 2014 .

Atomic Scale Thickness Control of SOI Wafers for Fully Depleted Applications

Bich-Yen Nguyen, Christophe Maleville, Walter Schwarzenbach, 2013 .

Keynote) Low Temperature SmartCutTM Process for 3D Integration

Shay Reboh, Laurent Brunet, Frédéric Mazen, 2020 .

High Mobility Materials on Insulator for Advanced Technology Nodes

J. Widiez, Pascal Besson, Christophe Figuet, 2015 .

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Bich-Yen Nguyen, Christophe Maleville, Walter Schwarzenbach, 2011 .

(Invited) SOI-Type Bonded Structures for Advanced Technology Nodes

Y. Bogumilowicz, Cyril Guedj, Thomas Signamarcheix, 2014 .

FDSOI: From substrate to devices and circuit applications

Bich-Yen Nguyen, Walter Schwarzenbach, Carlos Mazure, 2010, 2010 Proceedings of ESSCIRC.

Ultra-Thin SOI/BOX Layers and Next Generations Planar Fully Depleted Substrates

Bich-Yen Nguyen, Christophe Maleville, Walter Schwarzenbach, 2012 .

Ultra-thin body & buried oxide SOI substrate development and qualification for Fully Depleted SOI device with back bias capability

Frederic Allibert, Bich-Yen Nguyen, Christophe Maleville, 2016 .

Ultra-Thin Film SOI/BOX Substrate Development, Its Application and Readiness

Bich-Yen Nguyen, Christophe Maleville, Walter Schwarzenbach, 2011 .