Xia Zhang

Three-dimensional PN junction capacitor for passive integration

Liqiang Cao, D. Guidotti, L. Wan, 2011 .

Thermal-mechanical simulation of embedded module based on organic substrate

Liqiang Cao, L. Wan, Hongwen He, 2013, 2013 IEEE International Symposium on Advanced Packaging Materials.

Development of a compact bandpass microstrip filter on low loss ultra-thin Coreless substrate for RF-SiP

Xia Zhang, Lixi Wan, Yu Sun, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Temperature-dependant thermal stress analysis of through-silicon-vias during manufacturing process

X. Jing, L. Wan, Daquan Yu, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Thermo-mechanical reliability study for 3D package module based on flexible substrate

Liqiang Cao, Fengze Hou, Lixi Wan, 2013, 2013 14th International Conference on Electronic Packaging Technology.