Xueping Guo

发表

Liqiang Cao, Fengman Liu, H. Xue, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Liqiang Cao, L. Wan, Jun Li, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Y. Wan, Huimin Qi, Ga Zhang, 2018, Journal of colloid and interface science.

Liqiang Cao, J. Ferreira, Qidong Wang, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Wenya Li, Yaxin Xu, Xiawei Yang, 2018, Journal of Materials Science & Technology.

Liqiang Cao, D. Guidotti, L. Wan, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Shuo Yin, Kang Yang, Xueping Guo, 2016, Journal of Thermal Spray Technology.

Y. Sun, P. Tong, J. Lin, 2017 .

Wenya Li, H. Liao, Xueping Guo, 2012, Journal of Thermal Spray Technology.

Liqiang Cao, Fengze Hou, Lixi Wan, 2013, 2013 14th International Conference on Electronic Packaging Technology.