C. K. Yeo

Solder joint reliability study of 256 pin, 0.4 mm pitch, PQFP

H.L.J. Pang, S. Mhaisalkar, H. Pang, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Transient Liquid Phase Sintering (TLPS) Conductive Adhesives for High Temperature Automotive Applications

C. K. Yeo, Binghua Pan, 2014 .

EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

S. Mhaisalkar, H. Pang, A. Yeo, 1996 .