Xunqing Shi
发表
J. Pang,
Yaofeng Sun,
Fan Wei,
2006,
2006 8th Electronics Packaging Technology Conference.
B. Xie,
Han Ding,
Xunqing Shi,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
B. Xie,
Xuejun Fan,
Xunqing Shi,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Xunqing Shi,
Z. P. Wang,
H.L.J. Pang,
2002
.
B. Xie,
Xuejun Fan,
Xunqing Shi,
2007,
2007 9th Electronics Packaging Technology Conference.
Periannan Arulvanan,
Zhaowei Zhong,
Xunqing Shi,
2006,
Microelectron. Reliab..
Xunqing Shi,
John H. L. Pang,
Z. P. Wang,
2001
.
Pei Chen,
Bin Xie,
Fei Qin,
2016,
Microelectron. Reliab..
Guoliang Xu,
Xunqing Shi,
Chao Sun,
2020,
IEEE Access.
Xunqing Shi,
J. Pang,
Yaofeng Sun,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Wei Zhou,
Y.L. Zhang,
W. Zhou,
2008,
IEEE Transactions on Components and Packaging Technologies.