D. Day

发表

In-Situ Measurement of the Properties of Curing Systems with Microdielectrometry.

Norman F. Sheppard, Stephen D. Senturia, S. Senturia, 1982 .

Analysis of the resin transfer molding process using in-mold dielectric sensors

T. Whalen, D. Day, D. Melotik, 1993 .

Cure Characterization of Thick SMC Parts Using Dielectric and Finite Difference Analysis

D. Day, 1994 .

Dielectric determination of cure state during non-isothermal cure

D. Day, 1989 .

Electrical properties of ion‐implanted poly(p‐phenylene sulfide)

M. Dresselhaus, S. Senturia, G. Dresselhaus, 1983 .

Sodium transport in polyimide-SiO2 systems

Stephen D. Senturia, S. Senturia, H. J. Neuhaus, 1985 .

Moisture diffusion in poltimide films in integrated circuits

Stephen D. Senturia, D. D. Denton, S. Senturia, 1985 .

The role of boundary layer capacitance at blocking electrodes in the interpretation of dielectric cure data in adhesives

Stephen D. Senturia, S. Senturia, D. R. Day, 1985 .

Electrical conduction in polyimide between 20 and 350° C

Z. Feit, S. Senturia, F. Smith, 1987 .

Effects of stoichiometric mixing ratio on epoxy cure ― a dielectric analysis

D. Day, 1986 .

Electrical Properties of Ion Implanted Poly (P-Phenylene Sulfide)

M. Dresselhaus, S. Senturia, G. Dresselhaus, 1981 .

Polyimide planarization in integrated circuits

S. Senturia, D. Day, D. Ridley, 1984 .