Hiroshi Suzuki

High performance wafer level underfill material with high filler loading

Michael Gaynes, Claudius Feger, Jae-Woong Nah, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging

Michael A. Gaynes, Claudius Feger, Jae-Woong Nah, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).