Amit P. Marathe

Effects of active atomic sinks and reservoirs on the reliability of Cu∕low-k interconnects

Christine Hau-Riege, Carl V. Thompson, Frank L. Wei, 2008 .

Optimizing the electromigration performance of copper interconnects

Larry Zhao, Hisao Kawasaki, C. Capasso, 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

Electromigration-induced extrusion failures in Cu/low-k interconnects

Christine Hau-Riege, Chee Lip Gan, Joost J. Vlassak, 2008 .

Wheatstone bridge method for electromigration study of solder balls in flip-chip packages

Paul S. Ho, Min Ding, R. Master, 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

Reliability challenges of high performance PD SOI CMOS with ultra-thin gate dielectrics

Akram A. Salman, Niraj Subba, J. Zhang, 2004 .

The effect of interlevel dielectric on the critical tensile stress to void nucleation for the reliability of Cu interconnects

Christine Hau-Riege, Stefan P. Hau-Riege, S. Hau-Riege, 2004 .