W.H. Teh

Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration

S. Arkalgud, W.H. Teh, R. Caramto, 2009, 2009 IEEE International Interconnect Technology Conference.

Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology

T. Matthias, M. Wimplinger, J. Burggraf, 2010, 2010 IEEE International Interconnect Technology Conference.

200-mm wafer-scale transfer of 0.18-/spl mu/m dual-damascene Cu/SiO/sub 2/ interconnection system to plastic substrates

R. Kumar, D.-L. Kwong, W.H. Teh, 2005, IEEE Electron Device Letters.