T. Fischer

Experimental and numerical investigations on the quasi-static structural properties of fibre metal laminates processed by thermoforming

J. Heingärtner, H. Palkowski, G. Ziegmann, 2020 .

A two-step UV curing process for producing high tensile stressed silicon nitride layers

S. Schulz, T. Gessner, L. Prager, 2012 .

Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS

S. Schulz, T. Gessner, L. Hofmann, 2016 .

Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials

S. Schulz, M. Schaller, T. Fischer, 2012 .

A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics

S. Schulz, T. Fischer, S. Zimmermann, 2016 .

Experimental investigations on a plasma assisted in situ restoration process for sidewall damaged ultra low-k dielectrics

S. Schulz, T. Fischer, S. Zimmermann, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Top-hat crashboxes of thermoplastic fibre-metal-laminates processed in one-step thermoforming: Experimental and numerical study

J. Heingärtner, H. Palkowski, M. Gude, 2021, Composites Part B: Engineering.

Single Semiconductor Nanocrystals under Compressive Stress: Reversible Tuning of the Emission Energy.

Anne Bottin, T. Basché, G. Hinze, 2017, Nano letters.

Study on processing galvanized steel/PA6 sandwich composites by hot-pressing: Influence of interface properties and surface treatment on the adhesion strength

H. Palkowski, G. Ziegmann, M. Harhash, 2020 .

Properties of hydrogen induced voids in silicon

M. Hiller, J. Weber, T. Fischer, 2005 .

A Less Damaging Patterning Regime for a Successful Integration of Ultra Low-k Materials in Modern Nanoelectronic Devices

S. Schulz, T. Gessner, M. Schaller, 2011 .