Byung-Youl Min

SAVIA, an advanced multi‐layer parallel lamination technique for high density, high performance printed circuit boards

Chang-Kyu Song, Tae-hoon Kim, Jee-Soo Mok, 2005 .

An Experimental Study on Structural Behaviour of Asymmetric H Beam Slim floor under Load Condition in Fire

Byung-Youl Min, Jae-Sung Lee, Hyung-Jun Kim, 2011 .