Meiyu Wang

Electrical method to measure the transient thermal impedance of insulated gate bipolar transistor module

Lei Wang, Xin Li, Guo-Quan Lu, 2015 .

An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packaging

Lei Wang, Xin Li, Xu Chen, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Pressureless Silver Sintering on Nickel for Power Module Packaging

Dushan Boroyevich, Rolando Burgos, Xin Li, 2019, IEEE Transactions on Power Electronics.