Koji Fujimoto

Wafer-on-wafer (WOW) stacking with damascene-contact TSV for 3D integration

Takayuki Ohba, Hideki Kitada, Nobuhide Maeda, 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application.

Development of 300 mm TSV interposer with redistribution layers on both sides using MEMS processes

Ryutaro Maeda, Toshihiro Itoh, Miyuki Akazawa, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

Takayuki Ohba, S. W. Kim, Hideki Kitada, 2012 .

A design guide of thermal resistance down to 30% for 3D multi-stack devices

Takayuki Ohba, Hiroyuki Ryoson, Koji Fujimoto, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Advanced wafer thinning technology and feasibility test for 3D integration

Young Suk Kim, Takayuki Ohba, Hideki Kitada, 2013 .

Development of multi-stack process on wafer-on-wafer (WOW)

Takayuki Ohba, Hideki Kitada, Nobuhide Maeda, 2010, 2010 IEEE CPMT Symposium Japan.

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Yoshihiro Nakata, Takayuki Ohba, Hideki Kitada, 2011 .

Development of TSV interposer with 300 mm wafer for 3D packaging

Ryutaro Maeda, Toshihiro Itoh, Miyuki Akazawa, 2013, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.