B. Zhao

Low-k dielectrics for ULSI multilevel interconnections: thickness-dependent electrical and dielectric properties

F. G. Shi, H. K. Kim, F. Shi, 2000, Conference Record of the 2000 IEEE International Symposium on Electrical Insulation (Cat. No.00CH37075).

Modeling of chemical-mechanical polishing with soft pads

Frank G. Shi, F. Shi, B. Zhao, 1998 .

Reliability and electrical properties of new low dielectric constant interlevel dielectrics for high performance ULSI interconnect

P. K. Vasudev, Thomas E. Seidel, T. Seidel, 1996, Proceedings of International Reliability Physics Symposium.

A new theory for CMP with soft pads

Frank G. Shi, B. Zhao, S.-Q. Wang, 1998, Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).

Low temperature and low cost planarised aluminium interconnect for sub-half micrometre VLSI circuits

P. K. Vasudev, V. Hoffman, T. E. Seidel, 1997 .

Thickness dependent glass transition temperature of PECVD low-k dielectric thin films: effect of deposition methods

Frank G. Shi, H. K. Kim, J. Yota, 2002 .