P. Giesen

Flexible electronics: Prediction of substrate deformation during different steps of the lithography process

M. Barink, E. Meinders, I. Yakimets, 2011 .

Roll-to-roll UV imprint lithography for flexible electronics

Erwin R. Meinders, Peter Giesen, Ionut Barbu, 2011 .

Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing

M. Barink, I. Yakimets, P. Giesen, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Hygroscopic and thermal micro deformations of plastic substrates for flexible electronics using digital image correlation

M. Barink, E. Meinders, I. Yakimets, 2011 .

Polymer Substrates for Flexible Electronics: Achievements and Challenges

Erwin R. Meinders, Peter Giesen, Iryna Yakimets, 2010 .

Anodic bonding using the low expansion glass ceramic Zerodur

J. V. Elp, P. Giesen, J. V. D. Velde, 2005 .