J.W. Joyner

A global interconnect design window for a three-dimensional system-on-a-chip

P. Zarkesh-Ha, J.D. Meindl, J.W. Joyner, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

A three-dimensional stochastic wire-length distribution for variable separation of strata

J.A. Davis, P. Zarkesh-Ha, J. Joyner, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).