V. Cherman

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Bart Vandevelde, E. Beyne, I. De Wolf, 2014, Microelectron. Reliab..

Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

E. Beyne, I. De Wolf, A. Ivankovic, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

E. Beyne, V. Cherman, M. Stucchi, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Thermo-mechanical impact of the underfill-microbump interaction in 3D stacked integrated circuits

E. Beyne, G. Van der Plas, I. De Wolf, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

I. De Wolf, A. Ivankovic, V. Cherman, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs

E. Beyne, G. Van der Plas, V. Cherman, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips

E. Beyne, G. Van der Plas, V. Cherman, 2011, 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

E. Beyne, G. Van der Plas, I. De Wolf, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

FET arrays as CPI sensors for 3D stacking and packaging characterization

E. Beyne, G. Van der Plas, I. De Wolf, 2012, 2012 IEEE International Reliability Physics Symposium (IRPS).

The underfill-microbump interaction mechanism in 3D ICs: Impact and mitigation of induced stresses

E. Beyne, I. De Wolf, A. Ivankovic, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).