M. Higashi

Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring

T. Kurihara, T. Kurihara, M. Sunohara, 2008, 2008 58th Electronic Components and Technology Conference.

Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)

K. Murayama, Masahiro Sunohara, M. Sunohara, 2009, 2009 59th Electronic Components and Technology Conference.