Yi-Koan Hong

Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning

Ahmed Busnaina, Tae-Gon Kim, Jin-Goo Park, 2006 .

The Effect of Additives in Post-Cu CMP Cleaning on Particle Adhesion and Removal

Ahmed Busnaina, Tae-Gon Kim, Jin-Goo Park, 2004 .