Jae-Han Kim

Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kyung-Woon Jang, Kyung-Wook Paik, H.-Y Son, 2008, 2008 58th Electronic Components and Technology Conference.

Flexible, highly efficient all-polymer solar cells

Cheng Wang, Biwu Ma, Bumjoon J. Kim, 2015, Nature Communications.

Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kyung-Woon Jang, Kyung-Wook Paik, H.-Y Son, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Tuning Mechanical and Optoelectrical Properties of Poly(3-hexylthiophene) through Systematic Regioregularity Control

Joon Hak Oh, Hojeong Yu, Taek-Soo Kim, 2015 .

Nanotextured Polymer Substrate for Flexible and Mechanically Robust Metal Electrodes by Nanoimprint Lithography.

Inkyu Park, Taek-Soo Kim, Sang-Keun Sung, 2015, ACS applied materials & interfaces.

Understanding mechanical behavior and reliability of organic electronic materials

Taek-Soo Kim, Reinhold H. Dauskardt, Nicholas Rolston, 2017 .