S.L. Wright

Unpinned GaAs MOS capacitors and transistors

J. Batey, S. Tiwari, S. Wright, 1988, IEEE Electron Device Letters.

3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

B. Dang, Sung K. Kang, B. Webb, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Characterization of stacked die using die-to-wafer integration for high yield and throughput

B. Dang, K. Sakuma, E. Sprogis, 2008, 2008 58th Electronic Components and Technology Conference.

A CMOS-compatible process for fabricating electrical through-vias in silicon

J. Knickerbocker, E. Sprogis, P. Andry, 2006, 56th Electronic Components and Technology Conference 2006.

Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization

J. Knickerbocker, E. Sprogis, K. Lee, 2006, 56th Electronic Components and Technology Conference 2006.

Assembly, Characterization, and Reworkability of Pb-free Ultra-Fine Pitch C4s for System-on-Package

A. Sharma, B. Dang, K. Sakuma, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Lateral Ga/sub 0.47/In/sub 0.53/As and GaAs p-i-n photodetectors by self-aligned diffusion

M.S. Milshtein, S. Tiwari, S. Wright, 1992, IEEE Photonics Technology Letters.