T. Sullivan

Investigation of via-dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications

J. Gill, A. von Glasow, S. Yankee, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

Predicting thermal behavior of interconnects

J. Gill, D. Harmon, T. Sullivan, 1999, 1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460).

Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics

J. Gill, C.-C. Yang, A. Cowley, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

Investigation of CVD SiCOH low-k time-dependent dielectric breakdown at 65nm node technology

J. Gill, M. Shinosky, T. Ema, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..