Changyoul Moon

发表

Electrical and Thermal Properties of Carbon-Nanotube Composite for Flexible Electric Heating-Unit Applications

Kunmo Chu, Yoonchul Sohn, Dongouk Kim, 2013, IEEE Electron Device Letters.

A low temperature, hermetic wafer level packaging method for RF MEMS switch

Qian Wang, Woonbae Kim, Insang Song, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging

Jian Cai, Woonbae Kim, Qian Wang, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging

Qian Wang, Woonbae Kim, Woon-Bae Kim, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..