B. Tolla

High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications

Yuan Zhao, D. Katze, John Wood, 2019 .

The Role of Organic Amines in Soldering Materials

B. Tolla, Xiang Wei, 2015 .

Smart Chemistry Towards Highly Efficient Soldering Material Formulation

Yanrong Shi, B. Tolla, Xiang Wei, 2015 .

Structural investigation of oxygen insertion within the Ce2Sn2O7–Ce2Sn2O8 pyrochlore solid solution by means of in situ neutron diffraction experiments

M. Pouchard, A. Demourgues, M. Ménétrier, 1999 .

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

B. Tolla, M. Hasnine, N. Vahora, 2018, Journal of Electronic Materials.

REACTIVITY OF NO-CLEAN FLUX RESIDUES IN ELECTRONIC ASSEMBLIES: A SYSTEMATIC STUDY

Yanrong Shi, B. Tolla, Hemal Bhavsar, 2016 .

Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu–Ge solder alloy

B. Tolla, M. Hasnine, M. Karasawa, 2017, Journal of Materials Science: Materials in Electronics.