A. Panigrahi

发表

A multi-walled carbon nanotube-zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection.

S. Singh, Vikrant Singh, Brince Paul K, 2017, The Analyst.

Design of LDPC Decoder Using FPGA: Review of Flexibility

A. K. Panda, A. Panigrahi, 2012 .

Interface and Reliability Analysis of Au-Passivated Cu–Cu Fine-Pitch Thermocompression Bonding for 3-D IC Applications

S. Singh, S. Vanjari, A. Panigrahi, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding

J. Joseph, S. Singh, S. Vanjari, 2022, IEEE Transactions on Semiconductor Manufacturing.

TCAD Simulation of a 10nm n-Channel Vertical Double Gate Silicon On Insulator MOSFET for Digital Applications

Ch Pratyusha Chowdari, K. Jamal, A. Panigrahi, 2022, 2022 13th International Conference on Computing Communication and Networking Technologies (ICCCNT).

Nonlithographic Fabrication of Plastic-Based Nanofibers Integrated Microfluidic Biochip for Sensitive Detection of Infectious Biomarker.

S. Singh, Vikrant Singh, A. Panigrahi, 2017, ACS applied materials & interfaces.

Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Satish Bonam, 2016 .

TCAD Analysis of Substrate Thickness of a 10nm Vertical Double Gate SOI n-Type MOSFET

Ch Pratyusha Chowdari, A. Panigrahi, Srinivas Varma, 2023, 2023 5th International Conference on Smart Systems and Inventive Technology (ICSSIT).

Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub micron thick heat spreading materials

S. Singh, P. Supraja, A. Panigrahi, 2017 .

“ Facile approach of enhanced heat mitigation between 3 D stacked layers by introducing a submicron thick heat spreading materials " , Extended

S. Singh, P. Supraja, A. Panigrahi, 2017 .

Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Tamal Ghosh, 2017 .

Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding

S. Singh, S. Vanjari, A. Panigrahi, 2017, IEEE Transactions on Electron Devices.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

S. Singh, S. Vanjari, A. Panigrahi, 2018, Electronic Materials Letters.

Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications

S. Singh, S. Vanjari, A. Panigrahi, 2018 .

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding

Tamal Ghosh, Shiv Govind Singh, Siva Rama Krishna Vanjari, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding

S. Singh, S. Vanjari, A. Panigrahi, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration

S. Singh, S. Vanjari, A. Panigrahi, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration

Tamal Ghosh, Shiv Govind Singh, Siva Rama Krishna Vanjari, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 160°C

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Satish Bonam, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration

S. Singh, S. Vanjari, A. Panigrahi, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).