Philip L. Flaitz

Cr migration on 193nm binary photomasks

William D. Hinsberg, Frances A. Houle, Geoffrey W. Burr, 2009, Advanced Lithography.

Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes

Fen Chen, Daniel C. Edelstein, Ian D. Melville, 2005, SPIE Optics East.

Co capping layers for Cu/low-k interconnects

Daniel C. Edelstein, C.-C. Yang, Philip L. Flaitz, 2012 .

Effect of Zn doping on SnAg solder microstructure and electromigration stability

Da-Yuan Shih, Philip L. Flaitz, Minhua Lu, 2009 .

56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme

Mignot Yann, Walter Kleemeier, Philip L. Flaitz, 2013 .