D. Bušek
发表
K. Dušek,
P. Veselý,
D. Bušek,
2019,
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
K. Dušek,
J. Sedlacek,
P. Mach,
2020
.
K. Dušek,
B. Illés,
O. Krammer,
2018,
Journal of Materials Processing Technology.
B. Illés,
A. Géczy,
D. Bušek,
2019
.
K. Dušek,
B. Illés,
O. Krammer,
2018,
International Journal of Heat and Mass Transfer.
B. Illés,
O. Krammer,
D. Nagy,
2017
.
K. Dušek,
B. Medgyes,
B. Illés,
2021,
International Journal of Heat and Mass Transfer.
K. Dušek,
P. Veselý,
O. Krammer,
2020
.
R. Polanský,
P. Mach,
A. Géczy,
2019,
Journal of Materials Science: Materials in Electronics.
K. Dušek,
B. Illés,
J. Ratajczak,
2019,
Journal of Alloys and Compounds.
B. Illés,
A. Géczy,
D. Bušek,
2016
.
K. Dušek,
B. Medgyes,
B. Illés,
2021
.
K. Dušek,
B. Illés,
O. Krammer,
2020,
Journal of Materials Science: Materials in Electronics.
K. Dušek,
B. Medgyes,
B. Illés,
2019,
Materials.
R. Polanský,
P. Mach,
D. Bušek,
2010,
3rd Electronics System Integration Technology Conference ESTC.
G. Harsányi,
O. Krammer,
A. Sipos,
2019,
Circuit World.
K. Dušek,
B. Illés,
D. Bušek,
2022,
Journal of Materials Research and Technology.
P. Mach,
D. Bušek,
K. Dušek,
2016,
Microelectron. Reliab..
B. Illés,
O. Krammer,
A. Géczy,
2020,
Soldering & Surface Mount Technology.
O. Krammer,
D. Bušek,
Bertalan Varga,
2016,
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME).
Mohamed Amine Alaya,
G. Harsányi,
A. Géczy,
2020,
Soldering & Surface Mount Technology.
Agata Skwarek,
Balázs Illés,
Attila Geczy,
2017
.
K. Dušek,
D. Bušek,
K. Sorokina,
2022,
2022 45th International Spring Seminar on Electronics Technology (ISSE).
K. Dušek,
B. Illés,
G. Harsányi,
2020,
Materials.
Mohamed Amine Alaya,
B. Illés,
A. Géczy,
2021,
Applied Sciences.
B. Illés,
A. Géczy,
D. Bušek,
2017,
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME).
M. Placek,
A. Géczy,
D. Bušek,
2016,
2016 39th International Spring Seminar on Electronics Technology (ISSE).
Modification of interfacial properties between filler particles in electrically conductive adhesives
P. Mach,
D. Bušek,
2011,
2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME).
P. Mach,
D. Bušek,
2010,
2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME).
P. Mach,
D. Bušek,
Jiří Sokol,
2023,
Information Security Solutions Europe.
K. Dušek,
B. Illés,
D. Bušek,
2023,
Ceramics International.
K. Dušek,
J. Vávra,
D. Bušek,
2016,
2016 39th International Spring Seminar on Electronics Technology (ISSE).
K. Dušek,
D. Bušek,
K. Sorokina,
2023,
2023 46th International Spring Seminar on Electronics Technology (ISSE).
K. Dušek,
A. Rudajevová,
D. Bušek,
2015,
2015 38th International Spring Seminar on Electronics Technology (ISSE).
A. Poruba,
Z. Remeš,
Brianna Conrad,
2018,
The Review of scientific instruments.
K. Dušek,
P. Hrzina,
J. Ševčík,
2018,
2018 41st International Spring Seminar on Electronics Technology (ISSE).
K. Dušek,
P. Veselý,
D. Bušek,
2021,
Polymers.
Karel Dusek,
D. Busek,
K. Dušek,
2016,
Microelectron. Reliab..
K. Dušek,
B. Illés,
A. Géczy,
2023,
Materials.
P. Mach,
D. Bušek,
D. Samal,
2006,
2006 29th International Spring Seminar on Electronics Technology.