S. Iijima

An over 110-GHz InP HEMT flip-chip distributed baseband amplifier with inverted microstrip line structure for optical transmission systems

N. Hara, T. Takahashi, T. Hirose, 2002, 24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu.

A new flip-chip MMIC technology with multi-layer transmission line structure for low-cost W-band transceivers

Y. Watanabe, T. Hirose, S. Masuda, 2001, GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191).

Heterogeneous Integration of Microwave GaN Power Amplifiers With Si Matching Circuits

N. Kurahashi, Masaru Sato, N. Okamoto, 2017, IEEE Transactions on Semiconductor Manufacturing.

Integrated module structure of fan-out wafer level package for terahertz antenna

Toshihide Suzuki, D. Ishibashi, Y. Kawano, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).