Donald Canaperi

Methods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond

Raghuveer Patlolla, Huai Huang, Terry Spooner, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes

Wei Wang, Raghuveer Patlolla, Elbert Huang, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Ruthenium interconnect resistivity and reliability at 48 nm pitch

Wei Wang, Raghuveer Patlolla, Huai Huang, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

The Effect of Material and Process Interactions on BEOL Integration

John C. Arnold, Terry A. Spooner, Satyavolu S. Papa Rao, 2009 .