J. Bertheau

Wafer level underfill entrapment in solder joint during thermocompression: Simulation and experimental validation

S. Joblot, R. Franiatte, A. Farcy, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Microstructural and morphological characterization of SnAgCu micro-bumps for integration in 3D interconnects

N. Hotellier, P. Coudrain, J. Charbonnier, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.