J.G.J. Beijer

Warpage minimization of the HVQFN map mould

W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Modelling methodology for linear elastic compound modelling versus visco-elastic compound modelling

W.D. van Driel, R.B.R. van Silfhout, Kouchi Zhang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Solution strategies for FEM analysis with nonlinear viscoelastic polymers

J. L. Spoormaker, J. Beijer, J. Spoormaker, 2002 .

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

K.M.B. Jansen, D.G. Yang, J.H.J. Janssen, 2005, 2005 6th International Conference on Electronic Packaging Technology.

Fatigue life of solder bumps in a system in package: relating power cycling to thermal cycling

M.Y. Jansen, J. Beijer, J.A. Bielen, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.