D. Dunn

65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH

S. Grunow, D. Restaino, A. Grill, 2006, 2006 International Interconnect Technology Conference.

Investigation of CVD SiCOH low-k time-dependent dielectric breakdown at 65nm node technology

J. Gill, M. Shinosky, T. Ema, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..

Integration of ALD-TaN Liners on Nanoporous Dielectrics

A. Simon, P. Flaitz, N. Fuller, 2005 .

Nanoporous Materials Integration Into Advanced Microprocessors

E. T. Ryan, A. Simon, S. Nitta, 2005 .

Effects of ion implantation on microstructure, endurance and wear behavior of IBAD MoS2

I. L. Singer, K. Wahl, D. Dunn, 2000 .

Guiding gate-etch process development using 3D surface reaction modeling for 7nm and beyond

Derren Dunn, Peter L. G. Ventzek, John R. Sporre, 2017, Advanced Lithography.

Bayesian dropout approximation in deep learning neural networks: analysis of self-aligned quadruple patterning

Allen H. Gabor, M. Shephard, S. Halle, 2022 .

A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

P. Oldiges, C. Park, N. Loubet, 2016, 2016 IEEE International Electron Devices Meeting (IEDM).

Etch correction and OPC: a look at the current state and future of etch correction

Derren Dunn, Ian Stobert, D. Dunn, 2013, Advanced Lithography.

Etch aware optical proximity correction: a first step toward integrated pattern engineering

Derren Dunn, Ian Stobert, Scott M. Mansfield, 2009, Advanced Lithography.