H. Hichri

65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH

S. Grunow, D. Restaino, A. Grill, 2006, 2006 International Interconnect Technology Conference.

Reliability Studies of Excimer Laser-Ablated Microvias Below 5 Micron Diameter in Dry Film Polymer Dielectrics for Next Generation, Panel-Scale 2.5D Interposer RDL

Rao Tummala, Fuhan Liu, Bartlet DeProspo, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multi-layer Routing with 10 µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging

K. Lang, M. Toepper, K. Hauck, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

[Clinical and pharmacokinetic study of amikacin in pediatrics].

M. Rodière, H. Hichri, D. Brunel, 1979, La Nouvelle presse medicale.

Kinetics and slurry-type reactor modelling during catalytic hydrogenation of o-cresol on Ni/SiO2

Julien Andrieu, Habib Hichri, J. Andrieu, 1991 .

Hepatotoxic Effects of Lead Acetate in Rats: Histopathological and Cytotoxic Studies

H. Hichri, Z. Haouas, M. Mehdi, 2014 .

High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell

D. Mocuta, C. Norris, C. Radens, 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..

Embedded Trench Redistribution Layers at 2 – 5 μ m Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20 – 40 μ m I / O Pitch Interposers

V. Sundaram, R. Tummala, Yuya Suzuki, 2017 .

Novel Process of RDL Formation for Advanced Packaging by Excimer Laser Ablation

H. Hichri, M. Arendt, Matthew Gingerella, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).