H. Nye

65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH

S. Grunow, D. Restaino, A. Grill, 2006, 2006 International Interconnect Technology Conference.

IBM Research Report Immersion Plating of Bismuth on Tin-Based Alloys to Stabilize Lead-Free Solders

E. I. Cooper, H. Nye, R. J. Alley, 2005 .

Electrochemical Fabrication of Mechanically Robust PbSn C4 Interconnections

Madhav Datta, Ho-Ming Tong, Panayotis C. Andricacos, 1995 .