Hiroto Ohtake

Highly selective and high rate SiO2 etching using argon-added C2F4/CF3I plasma

Seiji Samukawa, A. Koshiishi, S. Samukawa, 2003 .

Low-damage low-k etching with an environmentally friendly CF3I plasma

Seiichi Kondo, Seiji Samukawa, Shuichi Saito, 2008 .

Dual hard mask process for low-k porous organosilica dielectric in copper dual damascene interconnect fabrication

Yoshihiro Hayashi, Munehiro Tada, Shuichi Saito, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Two-Dimensional Self-Consistent Simulation of a DC Magnetron Discharge

Toshiaki Makabe, T. Makabe, N. Nakano, 1999 .

Mechanical Property Control of Low-$k$ Dielectrics for Diminishing Chemical Mechanical Polishing (CMP)-Related Defects in Cu-Damascene Interconnects

Yoshihiro Hayashi, M. Tagami, F. Ito, 2004 .

Charging-damage-free and precise dielectric etching in pulsed C2F4/CF3I plasma

Seiji Samukawa, S. Samukawa, H. Ohtake, 2002 .

Effect of stress control layer (SCL) on via-stability in organic low-k/Cu dual damascene interconnects under thermal cycle stress

Yoshihiro Hayashi, M. Tagami, H. Miyamoto, 2003, Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Yoshihiro Hayashi, Munehiro Tada, Shuichi Saito, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).