S. Furkay

Bottom-up methodology for predictive simulations of self-heating in aggressively scaled process technologies

A. Kerber, E. Maciejewski, C.-H. Lin, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

A Room Temperature 0.1 /spl mu/m CMOS on SOI

J. Warnock, S. Furkay, D. Moy, 1993, Symposium 1993 on VLSI Technology.

Numerical and experimental investigation of heat transfer phenomena over an electronic module

S. Furkay, Dereje Agonafer, 1988, InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88.

Measurement and 3D simulations of substrate noise isolation and resistance for mixed signal applications

S. Furkay, J.B. Johnson, M. Kumar, 2004, Digest of Papers. 2004 Topical Meeting onSilicon Monolithic Integrated Circuits in RF Systems, 2004..

Analysis of snubber-clamped diode-string mixed voltage interface ESD protection network for advanced microprocessors

S. Furkay, S.H. Voldman, G. Gerosa, 1995, Electrical Overstress/Electrostatic Discharge Symposium Proceedings.

22nm technology yield optimization using multivariate 3D virtual fabrication

B. Jagannathan, S. Furkay, S. Narasimha, 2013, 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).