Tom Tang

Innovative Flip Chip Package Solutions for Automotive Applications

David Ho, Jensen Tsai, Tom Tang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

RKE system activating function dependent on distance determination

Riad Ghabra, Tom Tang, 2006 .

Wireless fasten seatbelt detection using a high-frequency technology

Tom Tang, Riad Deaborn Heights Ghabra, 2006 .

Challenges of flip chip packaging with embedded fine line and multi-layer coreless substrate

David Ho, Albert Lan, Jensen Tsai, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Challenges of Ultra-Thin 5 Sides Molded WLCSP

Jerry Li, Albert Lan, Jensen Tsai, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Leveraging biological insight and environmental variation to improve phenotypic prediction: Integrating crop growth models (CGM) with whole genome prediction (WGP)

Tom Tang, Frank Technow, Carlos D. Messina, 2017 .

Flip chip packaging with pre-molded coreless substrate

Evan Chen, Albert Lan, Jensen Tsai, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Method and system for controlling a function by using a variable sensitivity receiver

Riad Ghabra, Tom Tang, 2006 .

Exotic Animal Training Facility. 16PP

Tom Tang, Bruce Love, Michael Hogan, 1998 .