C. Andersson

Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Johan Liu, P. Tegehall, D. Andersson, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

A compact V-band planar wideband bandpass filter based on Liquid Crystal Polymer substrates

H. Zirath, D. Kuylenstierna, Peng Cai, 2008, 2008 2nd Electronics System-Integration Technology Conference.

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni (P) metallization

Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, 56th Electronic Components and Technology Conference 2006.

Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free Solder Joints in Different Corrosive Environmental Conditions

J. Liu, J. Liu, C. Andersson, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components

Johan Liu, P. Tegehall, D. Andersson, 2008, IEEE Transactions on Components and Packaging Technologies.

Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..