T. Shibutani
发表
Qiang Yu,
S. Kondo,
T. Shibutani,
2007,
2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
M. Pecht,
T. Shibutani,
M. Osterman,
2009,
IEEE Transactions on Components and Packaging Technologies.
Jae-Chul Jin,
T. Shibutani,
M. Shiratori,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Qiang Yu,
S. Kondo,
T. Shibutani,
2007,
0709.1872.
Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis
Qiang Yu,
T. Shibutani,
M. Shiratori,
2007,
2007 9th Electronics Packaging Technology Conference.
Qiang Yu,
T. Shibutani,
M. Shiratori,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Qiang Yu,
T. Shibutani,
M. Shiratori,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Qiang Yu,
T. Shibutani,
M. Shiratori,
2008,
2008 Second International Conference on Thermal Issues in Emerging Technologies.
Qiang Yu,
T. Shibutani,
M. Shiratori,
2006,
IEEE Transactions on Electronics Packaging Manufacturing.
Qiang Yu,
T. Shibutani,
M. Osterman,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
Qiang Yu,
T. Shibutani,
Do-Seop Kim,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).