U. Kloter

Forced convective interlayer cooling in vertically integrated packages

H. Reichl, B. Wunderle, B. Michel, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Hierarchically Nested Channels for Fast Squeezing Interfaces With Reduced Thermal Resistance

B. Michel, T. Brunschwiler, H. Rothuizen, 2007, IEEE Transactions on Components and Packaging Technologies.

Hierarchical Nested Surface Channels for Reduced Particle Stacking and Low-Resistance Thermal Interfaces

B. Michel, T. Brunschwiler, T. Brunschwiler, 2007, Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

B. Michel, G. Natarajan, T. Brunschwiler, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

High-resolution patterning and transfer of thin PDMS films: fabrication of hybrid self-sealing 3D microfluidic systems

H. Wolf, D. Juncker, U. Kloter, 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.