Eric Kuah

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Cao Xi, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

John H. Lau, Ming Li, Cao Xi, 2017 .