Jeffrey Lam

发表

Solving 28 nm I/O circuit reliability issue due to IC design weakness

Yi Chao Low, Pik Kee Tan, Soon Leng Tan, 2018, Microelectron. Reliab..

Fault isolation using Electrically-enhanced LADA (EeLADA)

Hu Hao, Jeffrey Lam, S. H. Goh, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

A controlled, mechanical method for MEMS decapsulation

Pik Kee Tan, Jeffrey Lam, Hao Tan, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

In-depth circuits edit analysis to reveal the implantation-related defect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. J..

Prediction of Electrical and Physical Failure Analysis Success Using Artificial Neural Networks

Hao Hu, Lin Zhao, Jeffrey Lam, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Fault isolation of digital scan logic without ‘scan diagnosis’

Hu Hao, Jeffrey Lam, S. H. Goh, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Backside sample preparation with laser-enhanced chemical etching for infrared photon imaging

Yongfeng Lu, Qin Deng, Jeffrey Lam, 2005, SPIE LASE.

Static fault localization of subtle metallization defects using near infrared photon emission microscopy

Jeffrey Lam, G. B. Ang, Z. H. Mai, 2017, Microelectron. Reliab..

Debugging MBIST hard fails without bitmapping

Hu Hao, Jeffrey Lam, S. H. Goh, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Electrical analysis on implantation-related defect by nanoprobing methodology

Jeffrey Lam, C. Q. Chen, Francis Rivai, 2016, Microelectron. Reliab..

A Simple Method TOWARDS Decapping of the MEMS and CMOS Parts for CD Measurements and Failure Analysis

Dan Dan Wang, Jeffrey Lam, Zhi Hong Mai, 2013 .

Uncovered the “hidden real defect” masked by “other anomaly seen” through deep dive FA in wafer fabrication

Jeffrey Lam, Ang Ghim Boon, Angela Teo, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Concurrent built-in self-testing under the constraint of shared test resources and its test time reduction

Zhao Lin, Jeffrey Lam, S. H. Goh, 2017, Integr..

A non destructive scan diagnosis based fault isolation technique verification method using infrared laser stimulation on wafer level

Jeffrey Lam, S. H. Goh, B. L. Yeoh, 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Faster Localization of Logic Soft Failures Using a Combination of Scan Diagnosis at Reduced VDD and LADA

Hu Hao, Jeffrey Lam, SH Goh, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Wafer-level fault isolation approach to debug integrated circuits JTAG failures

Hu Hao, Jeffrey Lam, S. H. Goh, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

A detailed analysis scheme to interpret multiple photon emissions micrograph for improved diagnostic resolution on open defects

Hu Hao, Jeffrey Lam, S. H. Goh, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Invisible Defect Identification by Electrical Nanoprobing Analysis

Jeffrey Lam, P.T. Ng, C.Q. Chen, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Effectiveness of frequency mapping on 28 nm device broken scan chain failures.

Jeffrey Lam, He Ran, S H Goh, 2012, The Review of scientific instruments.

The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

Pik Kee Tan, Jeffrey Lam, Binghai Liu, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure

Fan Zhang, Jeffrey Lam, Zexiang Shen, 2013 .